Ansys Icepak is a CFD solver for electronics thermal management, predicting airflow, temperature, and heat transfer in IC packages, PCBs, and electronic assemblies. It provides powerful electronic cooling solutions using the Ansys Fluent CFD solver and supports conduction, convection, and radiation heat transfer analyses. Icepak facilitates quick thermal analysis of electromagnetic designs and offers extensive libraries for thermal liquid cooling and dynamic thermal management.
| Capabilities |
| Thermal Management: Simulates heat transfer and cooling in electronic systems. |
| Advanced CFD Modeling: Provides detailed analysis of airflow and thermal effects. |
| Electronics Cooling: Models cooling solutions for electronic components and systems. |
| Multi-Physics Integration: Combines thermal analysis with other physics simulations. |
| User-Friendly Interface: Intuitive tools for setting up and analyzing thermal simulations. |
Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics. Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).
- Unstructured, Body-fitted Meshing
- Comprehensive Thermal Reliability Solution
- High-fidelity CFD Solver
Product Specs
Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.
- MCAD and ECAD Support
- Solar radiation
- Parametrics and Optimization
- Customization and Automation
- Network Modeling
- DC Joule Heating Analysis
- Electro-thermal and Thermo-Mechanical
- Extensive Libraries for Thermal
- Liquid Cooling
- Dynamic Thermal Management
- Varying Flow and Power ROM
Key Features
Icepak includes all modes of heat transfer — conduction, convection and radiation — for steadystate and transient electronics cooling applications.
- Electronics Desktop 3D layout GUI
- DC joule heating analysis
- Multiple-fluid analysis
- Reduced order flow and thermal
- Thermo-electric cooler modeling
- Package characterization
- Integrated graphical modeling environment
