The AMD SP701 Evaluation Kit, equipped with the best-in-class performance-per-watt AMD Spartan™ 7 FPGA, is built for designs requiring sensor fusion such as industrial networking, embedded vision, and automotive applications. The SP701 features high I/O availability and I/O expansion capability via Pmods and FMC connectors, making it the largest IP development canvas for Spartan 7 FPGA users.
Key Features & Benefits:
Connectivity for sensor heavy applications
- Video interfaces including MIPI CSI, DSI, and HDMI
- Expandable I/O via Pmods and FPGA Mezzanine Card (FMC) interfaces
- Dual ethernet for industrial networking
Best-in-class performance and flexibility with the largest Spartan 7 device
- Built for connectivity with 400 available I/O pins
- Scalable across the industry’s broadest cost-optimized portfolio
Easy-to-use soft processor options for embedded applications
- Pre-configured MicroBlaze™ application processor, real-time processor, and microcontroller Example Designs with up to 200DMIPS of processing power
- Arm® Cortex®-M1 and Cortex-M3 DesignStart FPGA available
Featured AMD Device
- Featuring the Spartan 7 XC7S100 FPGA
| System Logic Cells | 102,400 |
| DSP Slices | 160 |
| Memory | 1,100Kb DRAM, 4,320Kb Block RAM |
| Maximum I/O Pins | 400 |
| Additional Features | 8 clock management tiles (1MMCM + 1 PLL)
1 analog to digital converter (XADC) 1 configuration AES / HMC Block |
